Invention Grant
- Patent Title: Chip sorting apparatus
- Patent Title (中): 芯片分拣装置
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Application No.: US14220060Application Date: 2014-03-19
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Publication No.: US09011638B2Publication Date: 2015-04-21
- Inventor: Chen-Ke Hsu , Liang Sheng Chi , Chun-Chang Chen , Win-Jim Su , Hsu-Cheng Lin , Mei-Ling Tsai , Yi Lung Liu , Chen Ou
- Applicant: Epistar Corporation
- Applicant Address: TW Hsinchu
- Assignee: Epistar Corporation
- Current Assignee: Epistar Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Patterson & Sheridan, LLP
- Priority: TW98124963A 20090723
- Main IPC: B32B38/10
- IPC: B32B38/10 ; H01L21/66 ; H01L21/67

Abstract:
A method of chip sorting comprises providing a chip holder having a first surface; providing multiple chips on the first surface; providing a chip receiver having a second surface, wherein the second surface faces the first surface; attaching the multiple chips to the second surface; decreasing an adhesion between the multiple chips and the first surface; and separating the multiple chips from the first surface after the step of decreasing the adhesion between the multiple chips and the first surface.
Public/Granted literature
- US20140202627A1 CHIP SORTING APPARATUS Public/Granted day:2014-07-24
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