Invention Grant
- Patent Title: Method for manufacturing ball joint
- Patent Title (中): 球接头制造方法
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Application No.: US13926506Application Date: 2013-06-25
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Publication No.: US09011744B2Publication Date: 2015-04-21
- Inventor: Seong-Rok Kim
- Applicant: Central Corporation
- Applicant Address: KR Changwon, Gyeongsangnam-do
- Assignee: Central Corporation
- Current Assignee: Central Corporation
- Current Assignee Address: KR Changwon, Gyeongsangnam-do
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Kongsik Kim
- Priority: KR10-2009-0039632 20090507
- Main IPC: B29C45/14
- IPC: B29C45/14 ; B29C45/03 ; F16C11/06 ; B29L31/04

Abstract:
Provided is an apparatus and method for manufacturing a ball joint that are capable of reducing a torque applied between a ball stud and a ball seat.The ball joint manufacturing apparatus includes an upper mold having a shape configured to injection-mold a ball seat formed of a synthetic resin material and surrounding the outside of a spherical head part of a ball stud; a lower mold installed under the upper mold and having a molding surface for forming a portion of the ball seat; a fixing jig configured to fix the ball stud to a molding position of the upper mold and the lower mold; and a rotary member configured to rotate the fixing jig.
Public/Granted literature
- US20130285269A1 METHOD FOR MANUFACTURING BALL JOINT Public/Granted day:2013-10-31
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