Invention Grant
- Patent Title: Hardening device
- Patent Title (中): 硬化装置
-
Application No.: US14033837Application Date: 2013-09-23
-
Publication No.: US09011760B2Publication Date: 2015-04-21
- Inventor: Junji Minoue , Hiroko Watanabe , Masayuki Koyama , Hideo Miyashita
- Applicant: Fuji Electronics Industry Co.
- Applicant Address: JP
- Assignee: Fuji Electronics Industry Co., Ltd.
- Current Assignee: Fuji Electronics Industry Co., Ltd.
- Current Assignee Address: JP
- Agency: Wood, Phillips, Katz, Clark & Mortimer
- Priority: JP2008-316954 20081212
- Main IPC: C21D9/08
- IPC: C21D9/08 ; H05B6/10 ; H05B6/06 ; H05B6/44

Abstract:
An object of the present invention is to provide a hardening method and a hardening device capable of successfully hardening a shaft and an inner wall of a hole of a work in which the hole is formed close to the shaft on a flat plate. A hardening device for hardening a shaft and an inner wall of a hole, the shaft extending vertically from a flat plate and the hole being formed adjacent to the shaft, includes a first heating coil that is a conductive body facing the shaft and a second heating coil that is a helical conductive body having at least a portion inserted into the hole, so that the first heating coil and the second heating coil heat the shaft and the inner wall of the hole respectively and simultaneously.
Public/Granted literature
- US20140021664A1 HARDENING METHOD AND HARDENING DEVICE Public/Granted day:2014-01-23
Information query