Invention Grant
- Patent Title: Integrated circuit package including embedded thin-film battery
- Patent Title (中): 集成电路封装，包括嵌入式薄膜电池
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Application No.: US14321422Application Date: 2014-07-01
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Publication No.: US09012264B2Publication Date: 2015-04-21
- Inventor: Michael J. Hundt , Haibin Du , Krishnan Kelappan , Frank Sigmund
- Applicant: STMicroelectronics, Inc.
- Applicant Address: US TX Coppell
- Assignee: STMicroelectronics, Inc.
- Current Assignee: STMicroelectronics, Inc.
- Current Assignee Address: US TX Coppell
- Agency: Seed IP Law Group PLLC
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/02 ; G06K19/077 ; H01M2/10 ; G21H1/06 ; H01L23/495 ; H01L23/00 ; H01L21/56
Abstract:
An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.
Public/Granted literature
- US20140315334A1 INTEGRATED CIRCUIT PACKAGE INCLUDING EMBEDDED THIN-FILM BATTERY Public/Granted day:2014-10-23
Information query
IPC分类:
