Invention Grant
US09012267B2 Method of manufacturing a packaged circuit including a lead frame and a laminate substrate
有权
制造包括引线框架和层叠基板的封装电路的方法
- Patent Title: Method of manufacturing a packaged circuit including a lead frame and a laminate substrate
- Patent Title (中): 制造包括引线框架和层叠基板的封装电路的方法
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Application No.: US13860974Application Date: 2013-04-11
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Publication No.: US09012267B2Publication Date: 2015-04-21
- Inventor: Jian Yin , Nikhil Vishwanath Kelkar , Loyde Milton Carpenter, Jr.
- Applicant: Intersil Americas LLC
- Applicant Address: US CA Milpitas
- Assignee: Intersil Americas LLC
- Current Assignee: Intersil Americas LLC
- Current Assignee Address: US CA Milpitas
- Agency: Fogg & Powers LLC
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L23/495 ; H01L23/00
Abstract:
Embodiments of the subject application provide for a circuit comprising: a lead frame having a first plurality of exposed terminals, the lead frame defining a plane; a laminate substrate in the plane defined by the lead frame, adjacent to the lead frame, and electrically coupled to the lead frame, the laminate substrate having a first surface including a second plurality of exposed terminals and a second surface opposite the first surface; a first one or more dies mounted on the lead frame and electrically coupled to the lead frame; and a second one or more dies mounted on the second surface of the laminate substrate and electrically coupled to the laminate substrate.
Public/Granted literature
- US20130313694A1 PACKAGED CIRCUIT WITH A LEAD FRAME AND LAMINATE SUBSTRATE Public/Granted day:2013-11-28
Information query
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