Invention Grant
- Patent Title: Integrated circuit structures containing a strain-compensated compound semiconductor layer and methods and systems related thereto
- Patent Title (中): 包含应变补偿化合物半导体层的集成电路结构及其相关的方法和系统
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Application No.: US14016673Application Date: 2013-09-03
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Publication No.: US09012308B2Publication Date: 2015-04-21
- Inventor: Darwin Gene Enicks , John Chaffee , Damian A. Carver
- Applicant: Atmel Corporation
- Applicant Address: US CA San Jose
- Assignee: Atmel Corporation
- Current Assignee: Atmel Corporation
- Current Assignee Address: US CA San Jose
- Agency: Fish & Richardson P.C.
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/36 ; H01L31/20 ; H01L29/165 ; H01L29/66 ; H01L29/78 ; H01L21/02

Abstract:
A method for pseudomorphic growth and integration of an in-situ doped, strain-compensated metastable compound base into an electronic device, such as, for example, a SiGe NPN HBT, by substitutional placement of strain-compensating atomic species. The invention also applies to strained layers in other electronic devices such as strained SiGe, Si in MOS applications, vertical thin film transistors (VTFT), and a variety of other electronic device types. Devices formed from compound semiconductors other than SiGe, such as, for example, GaAs, InP, and AlGaAs are also amenable to beneficial processes described herein.
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