Invention Grant
- Patent Title: Carbon addition for low resistivity in situ doped silicon epitaxy
- Patent Title (中): 用于低电阻率原位掺杂硅外延的碳添加
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Application No.: US13193566Application Date: 2011-07-28
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Publication No.: US09012328B2Publication Date: 2015-04-21
- Inventor: Zhiyuan Ye , Xuebin Li , Saurabh Chopra , Yihwan Kim
- Applicant: Zhiyuan Ye , Xuebin Li , Saurabh Chopra , Yihwan Kim
- Applicant Address: unknown Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: unknown Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: H01L21/311
- IPC: H01L21/311 ; H01L21/02 ; H01L29/66 ; H01L29/78 ; H01L21/8238

Abstract:
Embodiments of the present invention generally relate to methods of forming epitaxial layers and devices having epitaxial layers. The methods generally include forming a first epitaxial layer including phosphorus and carbon on a substrate, and then forming a second epitaxial layer including phosphorus and carbon on the first epitaxial layer. The second epitaxial layer has a lower phosphorus concentration than the first epitaxial layer, which allows for selective etching of the second epitaxial layer and undesired amorphous silicon or polysilicon deposited during the depositions. The substrate is then exposed to an etchant to remove the second epitaxial layer and undesired amorphous silicon or polysilicon. The carbon present in the first and second epitaxial layers reduces phosphorus diffusion, which allows for higher phosphorus doping concentrations. The increased phosphorus concentrations reduce the resistivity of the final device. The devices include epitaxial layers having a resistivity of less than about 0.381 milliohm-centimeters.
Public/Granted literature
- US20120193623A1 CARBON ADDITION FOR LOW RESISTIVITY IN SITU DOPED SILICON EPITAXY Public/Granted day:2012-08-02
Information query
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