Invention Grant
- Patent Title: Topical composition for pain relief
- Patent Title (中): 用于缓解疼痛的专题组成
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Application No.: US13295142Application Date: 2011-11-14
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Publication No.: US09012486B2Publication Date: 2015-04-21
- Inventor: Alex Chervinsky
- Applicant: Alex Chervinsky
- Agent Ted Whitlock
- Main IPC: A61K45/06
- IPC: A61K45/06 ; A61K31/135 ; A61K31/167 ; A61K31/192 ; A61K31/195 ; A61K31/197 ; A61K31/4168
Abstract:
Described is a topically applied composition relief of pain. Also described are methods of preparing the composition and methods of using the composition to relieve pain.
Public/Granted literature
- US20130123320A1 TOPICAL COMPOSITION FOR PAIN RELIEF Public/Granted day:2013-05-16
Information query
