An aqueous epoxy resin system AB is described comprising an aqueously dispersed epoxy resin A having, on the average, at least one epoxy group per molecule, and a water-soluble or water-dispersible curing agent B which comprises the reaction product of an amine B1 having at least one primary and/or at least one secondary amino group, an adduct B2 of a polyalkylene ether polyol B21 and an epoxide component B22, and an aromatic compound B3 having at least one acidic group selected from the group consisting of hydroxyl and carboxyl groups, which system can be applied by rolling, spraying or brushing to provide corrosion protection on base metals.