Invention Grant
US09012555B2 UV-curable thermoformable dielectric for thermoformable circuits
有权
用于可热成型电路的UV固化热成型电介质
- Patent Title: UV-curable thermoformable dielectric for thermoformable circuits
- Patent Title (中): 用于可热成型电路的UV固化热成型电介质
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Application No.: US14049610Application Date: 2013-10-09
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Publication No.: US09012555B2Publication Date: 2015-04-21
- Inventor: Jay Robert Dorfman
- Applicant: E I du Pont de Nemours and Company
- Applicant Address: US DE Wilmington
- Assignee: E I du Pont de Nemours and Company
- Current Assignee: E I du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01B3/44 ; C09D175/16 ; C09D133/14 ; H01B3/30 ; C08G18/67 ; C08F290/06 ; H01L23/29 ; H01L23/00
Abstract:
This invention is directed to a polymer thick film UV-curable thermoformable dielectric composition. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive thermoformable silver and the polycarbonate substrate below it in capacitive switch applications. The thermoformed capacitive switch circuit may be subsequently subjected to an injection molding process.
Public/Granted literature
- US20140350162A1 UV-CURABLE THERMOFORMABLE DIELECTRIC FOR THERMOFORMABLE CIRCUITS Public/Granted day:2014-11-27
Information query
IPC分类:
