A polyamide molding composition is described comprising the following components (A)-(C) in the following composition, where the entirety of components (A), (B) and (C) gives 100% by weight: (A) from 25 to 75% by weight of at least one transparent copolyamide composed of (a) from 50 to 90 mol % of a cycloaliphatic diamine selected from the group consisting of: bis(4-amino-3-methylcyclohexyl)methane (MACM), bis(4-aminocyclohexyl)methane (PACM), bis(4-amino-3-ethylcyclohexyl)methane (EACM), bis(4-amino-3,5-dimethylcyclohexyl)methane (TMACM) and mixtures thereof and (b) from 10 to 50 mol % of an unbranched, aliphatic diamine, based in each case on the total amount of diamines, and also (c) of one or more aliphatic and cycloaliphatic dicarboxylic acid(s), (B) from 25 to 75% by weight of at least one further polyamide of PAXY type, where X and Y can assume, independently of one another, the values from 9 to 14, (C) from 0 to 10% by weight of additives.