Invention Grant
- Patent Title: Conductive path structure and wire harness
- Patent Title (中): 导电路径结构和线束
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Application No.: US13819118Application Date: 2011-09-16
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Publication No.: US09012777B2Publication Date: 2015-04-21
- Inventor: Hideomi Adachi , Hidehiko Kuboshima
- Applicant: Hideomi Adachi , Hidehiko Kuboshima
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-207548 20100916
- International Application: PCT/JP2011/071784 WO 20110916
- International Announcement: WO2012/036321 WO 20120322
- Main IPC: H01R3/00
- IPC: H01R3/00 ; B60K28/14 ; H01B7/32 ; B60K28/00

Abstract:
A conductive path structure includes a conductor that includes a first conductive portion and a second conductive portion which are connected to each other through a cut-off facilitating portion, and a semi-solid state insulation member that is in a semi-solid state and covers the cut-off facilitating portion. When the cut-off facilitating portion is cut off so as to separate the first conductive portion and the second conductive portion to each other due to an impact applied to the cut-off facilitating portion, the semi-solid state insulation member covers end portions of the separated first conductive portion and the separated second conductive portion which are close to the cut-out facilitating portion.
Public/Granted literature
- US20130153294A1 CONDUCTIVE PATH STRUCTURE AND WIRE HARNESS Public/Granted day:2013-06-20
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