Invention Grant
- Patent Title: Flexible multilayer substrate
- Patent Title (中): 柔性多层基板
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Application No.: US14047623Application Date: 2013-10-07
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Publication No.: US09012785B2Publication Date: 2015-04-21
- Inventor: Yoshihito Otsubo
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2011-088967 20110413
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K1/03 ; H05K1/09

Abstract:
A flexible multilayer substrate includes a multilayer body including a plurality of laminated resin layers. The multilayer body includes an innermost surface, which is a surface on an inner side when the substrate is bent, and an outermost surface, which is a surface on an outer side when the substrate is bent. Each of the plurality of resin layers includes a skin layer on one surface. Lamination of the multilayer body includes a skin layer joint plane at one location at a central portion in the thickness direction, and the skin layer and other surface come in contact with each other at another location along the central portion in the thickness direction. A skin layer joint plane is arranged on a side closer to the innermost surface than a central plane in the thickness direction of the multilayer body.
Public/Granted literature
- US20140034365A1 FLEXIBLE MULTILAYER SUBSTRATE Public/Granted day:2014-02-06
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