Invention Grant
- Patent Title: Printed circuit board with embedded heater
- Patent Title (中): 带嵌入式加热器的印刷电路板
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Application No.: US13482702Application Date: 2012-05-29
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Publication No.: US09012811B2Publication Date: 2015-04-21
- Inventor: Gil White
- Applicant: Gil White
- Applicant Address: US MO St. Louis
- Assignee: Viasystems Technologies Corp. L.L.C.
- Current Assignee: Viasystems Technologies Corp. L.L.C.
- Current Assignee Address: US MO St. Louis
- Agency: Polsinelli PC
- Main IPC: H05B3/28
- IPC: H05B3/28 ; H05B3/30 ; H05K7/20 ; H05K1/02 ; H05K1/16
Abstract:
Aspects of the present invention are directed to providing a printed circuit board including a top conductive layer; a bottom conductive layer; a plurality of electronic components arranged on at least one of the top conductive layer or the bottom conductive layer; a heater layer interposed between the top conductive layer and the bottom conductive layer and configured to generate and transfer heat to at least one of the electronic components.
Public/Granted literature
- US20130180973A1 PRINTED CIRCUIT BOARD WITH EMBEDDED HEATER Public/Granted day:2013-07-18
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