Invention Grant
- Patent Title: Semiconductor light emitting device
- Patent Title (中): 半导体发光器件
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Application No.: US13826787Application Date: 2013-03-14
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Publication No.: US09012886B2Publication Date: 2015-04-21
- Inventor: Jongil Hwang , Shinji Saito , Rei Hashimoto , Shinya Nunoue
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2012-179522 20120813
- Main IPC: H01L31/00
- IPC: H01L31/00 ; H01L33/32 ; H01L33/06

Abstract:
According to one embodiment, a semiconductor light emitting device includes: a first semiconductor layer; a second semiconductor layer; and a light emitting layer provided between the first and the second semiconductor layers. The first semiconductor layer includes a nitride semiconductor, and is of an n-type. The second semiconductor layer includes a nitride semiconductor, and is of a p-type. The light emitting layer includes: a first well layer; a second well layer provided between the first well layer and the second semiconductor layer; a first barrier layer provided between the first and the second well layers; and a first Al containing layer contacting the second well layer between the first barrier layer and the second well layer and containing layer containing Alx1Ga1-x1N (0.1≦x1≦0.35).
Public/Granted literature
- US20140042388A1 SEMICONDUCTOR LIGHT EMITTING DEVICE Public/Granted day:2014-02-13
Information query
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