Invention Grant
- Patent Title: Semiconductor light emitting device, wafer, method for manufacturing semiconductor light emitting device, and method for manufacturing wafer
- Patent Title (中): 半导体发光器件,晶片,半导体发光器件的制造方法以及晶片的制造方法
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Application No.: US13406705Application Date: 2012-02-28
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Publication No.: US09012888B2Publication Date: 2015-04-21
- Inventor: Mitsuhiro Kushibe , Yasuo Ohba , Hiroshi Katsuno , Kei Kaneko , Shinji Yamada
- Applicant: Mitsuhiro Kushibe , Yasuo Ohba , Hiroshi Katsuno , Kei Kaneko , Shinji Yamada
- Applicant Address: JP Tokyo
- Assignee: Kabushiki kaisha Toshiba
- Current Assignee: Kabushiki kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2011-202319 20110915
- Main IPC: H01L33/06
- IPC: H01L33/06 ; H01L33/32 ; H01L33/00

Abstract:
According to one embodiment, a semiconductor light emitting device includes a first layer of n-type and a second layer of p-type including a nitride semiconductor, a light emitting unit provided between the first and second layers, a first stacked structure provided between the first layer and the light emitting unit, and a second stacked structure provided between the first layer and the first stacked structure. The light emitting unit includes barrier layers and a well layer provided between the barrier layers. The first stacked structure includes third layers including a nitride semiconductor, and fourth layers stacked with the third layers and including GaInN. The fourth layers have a thinner thickness than the well layer. The second stacked structure includes fifth layers including a nitride semiconductor, and sixth layers stacked with the fifth layers and including GaInN. The sixth layers have a thinner thickness than the well layer.
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