Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14448345Application Date: 2014-07-31
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Publication No.: US09012923B2Publication Date: 2015-04-21
- Inventor: Johji Nishio , Tatsuo Shimizu , Ryosuke Iijima , Chiharu Ota , Takashi Shinohe
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L29/36 ; H01L29/16 ; H01L29/167 ; H01L29/78

Abstract:
A semiconductor device of an embodiment includes: an n-type first SiC epitaxial layer; a p-type second SiC epitaxial layer on the first SiC epitaxial layer containing a p-type impurity and an n-type impurity, the p-type impurity being an element A, the n-type impurity being an element D, the element A and the element D forming a combination of Al, Ga, or In and N, and/or a combination of B and P, the ratio of the concentration of the element D to the element A being higher than 0.33 but lower than 1.0; a surface region at the surface of the second SiC epitaxial layer containing the element A at a lower concentration than in the second SiC epitaxial layer, the ratio being higher than in the second SiC epitaxial layer; n-type first and second SiC regions; a gate insulating film; a gate electrode; a first electrode; and a second electrode.
Public/Granted literature
- US20150034974A1 SEMICONDUCTOR DEVICE Public/Granted day:2015-02-05
Information query
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