Invention Grant
- Patent Title: Method of forming semiconductor layer and semiconductor light emitting device
- Patent Title (中): 形成半导体层和半导体发光器件的方法
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Application No.: US14013678Application Date: 2013-08-29
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Publication No.: US09012934B2Publication Date: 2015-04-21
- Inventor: Seong Suk Lee , Ok Hyun Kim , Dong Yul Lee , Dong Ju Lee , Jeong Wook Lee , Heon Ho Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0143437 20121211
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/12 ; H01L33/22

Abstract:
A method of forming a semiconductor layer is provided. The method includes forming a plurality of nanorods on a substrate and forming a lower semiconductor layer on the substrate so as to expose at least portions of the nanorods. The nanorods are removed so as to form voids in the lower semiconductor layer, and an upper semiconductor layer is formed on an upper portion of the lower semiconductor layer and the voids.
Public/Granted literature
- US20140159081A1 METHOD OF FORMING SEMICONDUCTOR LAYER AND SEMICONDUCTOR LIGHT EMITTING DEVICE Public/Granted day:2014-06-12
Information query
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