Invention Grant
- Patent Title: Light emitting diode device, light emitting apparatus and method of manufacturing light emitting diode device
- Patent Title (中): 发光二极管装置,发光装置及制造发光二极管装置的方法
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Application No.: US13859461Application Date: 2013-04-09
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Publication No.: US09012941B2Publication Date: 2015-04-21
- Inventor: Jung Kyu Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Seoul
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2009-0097160 20091013
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/50 ; H01L33/54 ; H01L33/62

Abstract:
Provided is a light emitting diode device. The light emitting diode device includes a light emitting diode chip having a first surface on which first and second electrodes are disposed, and a second surface opposing the first surface, a wavelength conversion portion including fluorescent substances and covering the first surface and side surfaces of the light emitting diode chip, wherein the side surfaces denote surfaces placed between the first and second surfaces, and first and second electricity connection portions each including a plating layer, respectively connected to the first and second electrodes, and exposed to the outside of the wavelength conversion portion. Accordingly, the light emitting diode device, capable of enhancing luminous efficiency and realizing uniform product characteristics in terms of the emission of white light, is provided. Further, a process for easily and efficiently manufacturing the above light emitting diode device is provided.
Public/Granted literature
Information query
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