A semiconductor device, and more particularly a light emitting device package usable with a lighting apparatus is disclosed. The light emitting device package comprises a package body, a light emitting device located on the package body, the light emitting device emitting light having a first wavelength band, a transparent substrate located over the light emitting device with a distance therebetween, a wavelength conversion layer located on the transparent substrate, wherein the wavelength conversion layer absorbs and converts at least a part of the light having the first wavelength band into light having a second wavelength band, and a color calibration layer located on the wavelength conversion layer, the color calibration layer calibrating color of the wavelength conversion layer.