Invention Grant
- Patent Title: Fabrication of electronic and photonic systems on flexible substrates by layer transfer method
- Patent Title (中): 通过层转移法在柔性基板上制作电子和光子系统
-
Application No.: US13534094Application Date: 2012-06-27
-
Publication No.: US09012992B2Publication Date: 2015-04-21
- Inventor: Il-Doo Kim , Harry L. Tuller , Yong Woo Choi , Akintunde I. Akinwande
- Applicant: Il-Doo Kim , Harry L. Tuller , Yong Woo Choi , Akintunde I. Akinwande
- Applicant Address: US MA Cambridge
- Assignee: Massachusetts Institute of Technology
- Current Assignee: Massachusetts Institute of Technology
- Current Assignee Address: US MA Cambridge
- Agency: Gesmer Updegrove LLP
- Main IPC: H01L21/331
- IPC: H01L21/331 ; H01L21/20 ; H01L51/00 ; H01L41/313
Abstract:
A transfer layer includes a transparent substrate. A buffer layer is formed on the transparent substrate that comprises PbO, GaN, PbTiO3, La0.5Sr0.5CoO3 (LSCO), or LaxPb1-xCoO3 (LPCO) so that separation between the buffer layer and the transparent substrate occurs at substantially high temperatures.
Public/Granted literature
- US20120273784A1 FABRICATION OF ELECTRONIC AND PHOTONIC SYSTEMS ON FLEXIBLE SUBSTRATES BY LAYER TRANSFER METHOD Public/Granted day:2012-11-01
Information query
IPC分类:
