Invention Grant
US09013029B2 Joined body having an anti-corrosion film formed around a junction portion, and a semiconductor device having the same
有权
具有形成在接合部周围的防腐蚀膜的接合体以及具有该防腐蚀膜的半导体器件
- Patent Title: Joined body having an anti-corrosion film formed around a junction portion, and a semiconductor device having the same
- Patent Title (中): 具有形成在接合部周围的防腐蚀膜的接合体以及具有该防腐蚀膜的半导体器件
-
Application No.: US13882436Application Date: 2012-08-08
-
Publication No.: US09013029B2Publication Date: 2015-04-21
- Inventor: Masanori Minamio , Tatsuo Sasaoka
- Applicant: Masanori Minamio , Tatsuo Sasaoka
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2011-183714 20110825
- International Application: PCT/JP2012/005039 WO 20120808
- International Announcement: WO2013/027354 WO 20130228
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48 ; H01L23/433 ; B23K20/02 ; B23K20/16 ; B23K20/227 ; B23K20/233 ; B23K35/00
Abstract:
A joined body which is formed by, first, an aqueous solution containing an oxide film remover is disposed on a junction region of a first metal plate. Then, with the aqueous solution remaining on the first metal plate, a second metal plate is placed on the first metal plate. Thereafter, a load is applied to junction regions of the first metal plate and the second metal plate in the vertical direction, thereby joining the first metal plate and the second metal plate together to form a junction portion.
Public/Granted literature
Information query
IPC分类:
