Invention Grant
US09013030B2 Leadframe, semiconductor package including a leadframe and method for producing a leadframe
有权
引线框，包括引线框的半导体封装和用于制造引线框的方法
- Patent Title: Leadframe, semiconductor package including a leadframe and method for producing a leadframe
- Patent Title (中): 引线框，包括引线框的半导体封装和用于制造引线框的方法
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Application No.: US13852058Application Date: 2013-03-28
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Publication No.: US09013030B2Publication Date: 2015-04-21
- Inventor: Seliyan Sivaperumal , Wai Win Edwin Liew
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A lead frame includes a die pad and a lead finger with an inner portion which is configured to be electrically connected to contact pads of a die and with an outer portion which has an attach portion. The attach portion is configured to be soldered to an external solder pad, wherein the attach portion has a width, a length and a thickness. An opening extends through the thickness of the attach portion.
Public/Granted literature
- US20140291824A1 Leadframe, Semiconductor Package Including a Leadframe and Method for Producing a Leadframe Public/Granted day:2014-10-02
Information query
IPC分类:
