Invention Grant
US09013044B2 Through wire interconnect (TWI) for semiconductor components having wire in via and bonded connection with substrate contact
有权
用于半导体元件的导线互连（TWI），其具有通孔导线和与基板接触的结合连接
- Patent Title: Through wire interconnect (TWI) for semiconductor components having wire in via and bonded connection with substrate contact
- Patent Title (中): 用于半导体元件的导线互连（TWI），其具有通孔导线和与基板接触的结合连接
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Application No.: US13945392Application Date: 2013-07-18
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Publication No.: US09013044B2Publication Date: 2015-04-21
- Inventor: Alan G Wood , David R Hembree
- Applicant: Micron Technology Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agent Stephen A. Gratton
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L23/00 ; H01L23/31 ; H01L25/065 ; H01L21/683 ; H01L23/498
Abstract:
A through wire interconnect for a semiconductor substrate includes a via extending through the semiconductor substrate from the first side to the second side thereof; a wire in the via having a first end with a bonded connection to the substrate contact and a second end proximate to the second side of the semiconductor substrate; a dielectric material in the via configured to electrically insulate the wire from the semiconductor substrate; a bonding member bonded to the first end of the wire and to the substrate contact configured to secure the wire to the substrate contact; and a contact on the second end of the wire.
Public/Granted literature
Information query
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