Invention Grant
- Patent Title: Medical lead with filler layer
- Patent Title (中): 医用铅带填料层
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Application No.: US12900344Application Date: 2010-10-07
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Publication No.: US09014816B2Publication Date: 2015-04-21
- Inventor: Jacob E. Markham , John W. Warling , Victoria K. Sandberg
- Applicant: Jacob E. Markham , John W. Warling , Victoria K. Sandberg
- Applicant Address: DE Hanau
- Assignee: W. C. Heraeus GmbH
- Current Assignee: W. C. Heraeus GmbH
- Current Assignee Address: DE Hanau
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: A61N1/05
- IPC: A61N1/05 ; A61M25/09

Abstract:
A medical lead includes a first wire coil having an outer diameter and a marker coil having an inner diameter. The marker coil is assembled over the first wire coil. The outer diameter first wire coil is smaller than the inner diameter of the marker coil thereby defining a gap. A second wire coil substantially fills the gap between the first wire coil and the marker coil. A ball weld is formed at an end of the medical lead adjacent each of the first and second wire coils and adjacent the marker coil.
Public/Granted literature
- US20120089213A1 MEDICAL LEAD WITH FILLER LAYER Public/Granted day:2012-04-12
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