Invention Grant
- Patent Title: Temperature measurement device and temperature measuring method
- Patent Title (中): 温度测量装置和温度测量方法
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Application No.: US13229123Application Date: 2011-09-09
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Publication No.: US09015001B2Publication Date: 2015-04-21
- Inventor: Sakiko Shimizu
- Applicant: Sakiko Shimizu
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Global IP Counselors, LLP
- Priority: JP2010-243272 20101029
- Main IPC: G01K7/42
- IPC: G01K7/42 ; G01K1/16 ; G01K13/00

Abstract:
A temperature measurement device includes a temperature measurement part, a calculation part, and a control part for controlling the operation of the temperature measurement part and the calculation part; wherein the temperature measurement part has a substrate having a first surface as a contact surface with a measured body, and a second surface as an environment-side surface which is opposite the first surface; a first temperature sensor; a second temperature sensor; and an environment temperature acquiring part; and the first temperature sensor and the second temperature sensor measure a first temperature and a second temperature a plurality of times under conditions in which a third temperature varies; and the calculation part calculates a deep temperature in a deep part of the measured body, on the basis of a deep temperature calculation equation, by using the measured temperatures.
Public/Granted literature
- US20120109572A1 TEMPERATURE MEASUREMENT DEVICE AND TEMPERATURE MEASURING METHOD Public/Granted day:2012-05-03
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