Invention Grant
- Patent Title: Multi-chip package and operating method thereof
- Patent Title (中): 多芯片封装及其操作方法
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Application No.: US13572086Application Date: 2012-08-10
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Publication No.: US09015392B2Publication Date: 2015-04-21
- Inventor: Won-Kyung Kang , Sam-Kyu Won
- Applicant: Won-Kyung Kang , Sam-Kyu Won
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2012-0053742 20120521
- Main IPC: G06F13/00
- IPC: G06F13/00 ; G11C5/14
Abstract:
A multi-chip package includes first and second semiconductor chips each configured to perform first and second operations having different current consumptions. The first and second semiconductor chips perform the first operation in response to an enable control signal transmitted from one of the first and second semiconductor chips to the other and transmitted from the other back to the one.
Public/Granted literature
- US20130307611A1 MULTI-CHIP PACKAGE AND OPERATING METHOD THEREOF Public/Granted day:2013-11-21
Information query
