Invention Grant
- Patent Title: High frequency wiring board comprised of interconnected first and second coplanar lines on different layers and having a ground pattern physically separated therefrom
- Patent Title (中): 高频布线板由不同层上互连的第一和第二共面线构成，并具有与其物理分离的接地图案
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Application No.: US12674221Application Date: 2008-07-24
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Publication No.: US09019035B2Publication Date: 2015-04-28
- Inventor: Risato Ohhira
- Applicant: Risato Ohhira
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2007-241104 20070918
- International Application: PCT/JP2008/063283 WO 20080724
- International Announcement: WO2009/037918 WO 20090326
- Main IPC: H01P3/08
- IPC: H01P3/08 ; H05K1/02 ; H01P1/04 ; H01L23/66
Abstract:
The high-frequency wiring board of the present invention includes: first coplanar lines provided with a first signal line and a first planar ground pattern formed on the same wiring layer as the first signal line; second coplanar lines provided with a second signal line formed on a different wiring layer than the first signal line and a second planar ground pattern formed on the same wiring layer as the second signal line; and a first ground pattern formed on the same wiring layer as the first coplanar lines. The first coplanar lines and the second coplanar lines are connected. At least the first ground pattern and the first planar ground pattern are separated in a region following the second signal line from the connection of the first signal line and the second signal line.
Public/Granted literature
- US20110128100A1 HIGH-FREQUENCY WIRING BOARD AND HIGH-FREQUENCY MODULE THAT USES THE WIRING BOARD Public/Granted day:2011-06-02
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