Invention Grant
- Patent Title: Seal with energy-absorbing filler and method of manufacture
- Patent Title (中): 用吸收能量的填料和制造方法密封
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Application No.: US14260763Application Date: 2014-04-24
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Publication No.: US09019683B2Publication Date: 2015-04-28
- Inventor: Arthur C. Day , James P. Irwin , Eddie Kwon , Carl R. McIver , Kevin E. McCrary
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Thompson Hine LLP
- Main IPC: H05F3/00
- IPC: H05F3/00 ; H01R43/20 ; F16J15/14 ; F16L25/03 ; F16J15/06 ; H01R13/52 ; F16L47/22
Abstract:
A method for sealing an interface to attenuate high energy currents and voltages traveling thereacross may include forming a cover defining an inner volume shaped to enclose the interface; forming a filled sealant including a semi-rigid sealant mixed with a filler having a multiplicity of discrete particles of different composition than the semi-rigid sealant; placing the filled sealant within the inner volume; and placing the cover containing the filled sealant over the interface such that the filled sealant is adjacent the interface.
Public/Granted literature
- US20140235083A1 Seal With Energy-Absorbing Filler and Method of Manufacture Public/Granted day:2014-08-21
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