Invention Grant
- Patent Title: Device with an integrated circuit
- Patent Title (中): 具有集成电路的装置
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Application No.: US13683286Application Date: 2012-11-21
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Publication No.: US09019717B2Publication Date: 2015-04-28
- Inventor: Gerd Scholten
- Applicant: Micronas GmbH
- Applicant Address: DE Freiburg
- Assignee: Micronas GmbH
- Current Assignee: Micronas GmbH
- Current Assignee Address: DE Freiburg
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: DE102011118932 20111121
- Main IPC: H01L23/50
- IPC: H01L23/50 ; H01L23/495

Abstract:
A device having an integrated circuit and a circuit package. A first terminal contact, a second terminal contact, and a third terminal contact are brought out of the circuit package. The first terminal contact and the second terminal contact are each connected to terminals of the integrated circuit for power supply. The third terminal contact is connected to a terminal of the integrated circuit in the circuit package for signal transmission. A first capacitor is connected to the first terminal contact and a second capacitor is connected to the third terminal contact, wherein a fourth terminal contact and a fifth terminal contact are brought out of the circuit package, and the first capacitor is connected to the fourth terminal contact, and the second capacitor is connected to the fifth terminal contact.
Public/Granted literature
- US20130128483A1 DEVICE WITH AN INTEGRATED CIRCUIT Public/Granted day:2013-05-23
Information query
IPC分类: