Invention Grant
- Patent Title: Removing piezoelectric material using electromagnetic radiation
- Patent Title (中): 使用电磁辐射去除压电材料
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Application No.: US13061722Application Date: 2008-09-23
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Publication No.: US09021699B2Publication Date: 2015-05-05
- Inventor: Jeffrey R. Pollard
- Applicant: Jeffrey R. Pollard
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: Hewlett-Packard Patent Department
- International Application: PCT/US2008/077308 WO 20080923
- International Announcement: WO2010/036235 WO 20100401
- Main IPC: B21D53/76
- IPC: B21D53/76 ; B23P17/00 ; H01L41/22 ; H04R17/00 ; B41J2/15 ; B41J2/145 ; B41J2/135 ; H01L41/338 ; B23K26/06 ; B23K26/08 ; B23K26/36 ; B23K26/40 ; B41J2/16 ; H01L41/313
Abstract:
Electromagnetic radiation is transmitted through a piezoelectric material and is absorbed in at least an adhesive that bonds the piezoelectric material to another material. Absorbing the electromagnetic radiation in the adhesive ablates the adhesive and the ablation of the adhesive acts to remove the piezoelectric material.
Public/Granted literature
- US20110168807A1 Removing Piezoelectric Material Using Electromagnetic Radiation Public/Granted day:2011-07-14
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