Invention Grant
- Patent Title: Compressor assembly having electronics cooling system and method
- Patent Title (中): 具有电子冷却系统和方法的压缩机总成
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Application No.: US14480350Application Date: 2014-09-08
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Publication No.: US09021823B2Publication Date: 2015-05-05
- Inventor: Jean-Luc M. Caillat
- Applicant: Emerson Climate Technologies, Inc.
- Applicant Address: US OH Sidney
- Assignee: Emerson Climate Technologies, Inc.
- Current Assignee: Emerson Climate Technologies, Inc.
- Current Assignee Address: US OH Sidney
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F25B31/00 ; F04B39/06 ; F04B49/10 ; F04B53/08 ; F04D13/06 ; F04D29/58 ; F25B41/06 ; F25B49/02 ; F25B13/00
Abstract:
A system, compressor, and method that cools an electronics module with a low-pressure refrigerant. The system, compressor, and method utilize a temperature sensor that detects a temperature of the low pressure refrigerant and communicates with the electronics module. Based on the temperature detected by the temperature sensor, the electronics module controls a liquid dry out point of the refrigerant that is used to cool the electronics module.
Public/Granted literature
- US20140377102A1 COMPRESSOR ASSEMBLY HAVING ELECTRONICS COOLING SYSTEM AND METHOD Public/Granted day:2014-12-25
Information query
