Invention Grant
- Patent Title: Chamfer cutting device
- Patent Title (中): 倒角切割装置
-
Application No.: US13380640Application Date: 2010-06-25
-
Publication No.: US09021850B2Publication Date: 2015-05-05
- Inventor: Mark R. Gabel
- Applicant: Mark R. Gabel
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Dena M. Ehrich
- International Application: PCT/US2010/039960 WO 20100625
- International Announcement: WO2011/002681 WO 20110106
- Main IPC: B21D31/02
- IPC: B21D31/02 ; B23D15/00 ; B21D19/00 ; B26D3/02 ; B26D3/06 ; B26D7/26 ; B26D7/00 ; B26D1/06

Abstract:
Chamfer cutting devices are described. The chamfer cutting devices include a mounting bracket, an electromagnet rigidly attached to the mounting bracket, a hold/release arm magnetically coupled to the electromagnet, a chamfer former rigidly attached to the hold/release arm, wherein the chamfer cutter comprises two bending beams, each terminating in a chamfer point, and a blade rigidly connected to the mounting bracket and positioned between the chamfer points. Dispensers incorporating such chamfer cutting devices and methods of chamfer cutting are also described.
Public/Granted literature
- US20120097696A1 CHAMFER CUTTING DEVICE Public/Granted day:2012-04-26
Information query