Invention Grant
- Patent Title: Micromachined piezoelectric three-axis gyroscope and stacked lateral overlap transducer (slot) based three-axis accelerometer
- Patent Title (中): 微加工压电三轴陀螺仪和层叠横向重叠传感器(槽)三轴加速度计
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Application No.: US12930229Application Date: 2010-12-30
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Publication No.: US09021880B2Publication Date: 2015-05-05
- Inventor: Philip Jason Stephanou , Cenk Acar , Ravindra Vaman Shenoy , David William Burns , Justin Phelps Black , Kurt Edward Petersen , Srinivasan Kodaganallur Ganapathi
- Applicant: Philip Jason Stephanou , Cenk Acar , Ravindra Vaman Shenoy , David William Burns , Justin Phelps Black , Kurt Edward Petersen , Srinivasan Kodaganallur Ganapathi
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Weaver Austin Villeneuve & Sampson
- Main IPC: G01P15/125
- IPC: G01P15/125 ; G01P15/18 ; G01C25/00 ; G01C19/5712 ; G01C19/5747 ; G01P15/08

Abstract:
This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using x-axis gyroscopes, y-axis gyroscopes, z-axis gyroscopes, two-axis accelerometers and three-axis accelerometers. Combining fabrication processes for such devices can enable the monolithic integration of six inertial sensing axes on a single substrate, such as a single glass substrate. Such devices may be included in a mobile device, such as a mobile display device.
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