Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method for successively processing a plurality of substrates
- Patent Title (中): 用于连续处理多个基板的基板处理装置和基板处理方法
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Application No.: US13365731Application Date: 2012-02-03
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Publication No.: US09022046B2Publication Date: 2015-05-05
- Inventor: Eisaku Machida
- Applicant: Eisaku Machida
- Applicant Address: JP
- Assignee: Screen Holdings Co., Ltd.
- Current Assignee: Screen Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2008-097113 20080403
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677 ; H01L21/687

Abstract:
One of reverse passing parts provided in a substrate passing part comprises a first holding mechanism and a second holding mechanism. The first holding mechanism and the second holding mechanism are arranged in vertically symmetry with respect to a rotary central axis and rotate 180 degrees about the rotary central axis, to replace each other in position. A transport robot on the loading side passes a substrate to a third holding mechanism or a fourth holding mechanism at a first vertical position. The substrate reversed in the reverse passing part is passed to a transport robot on the unloading side from the third holding mechanism or the fourth holding mechanism at a second vertical position. Before a reverse process on the preceding substrate is finished, the transport robot on the loading side can start the transfer of the following substrate.
Public/Granted literature
Information query
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