Invention Grant
- Patent Title: Heat transport fluid passage device with hydrophobic membrane
- Patent Title (中): 带有疏水膜的传热流体通道装置
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Application No.: US13291445Application Date: 2011-11-08
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Publication No.: US09022099B2Publication Date: 2015-05-05
- Inventor: Rie Fukuta , Yoshimasa Hijikata , Yoshiyasu Yamada , Shinichi Yatsuzuka , Kenji Takigawa , Tetsuo Toyama
- Applicant: Rie Fukuta , Yoshimasa Hijikata , Yoshiyasu Yamada , Shinichi Yatsuzuka , Kenji Takigawa , Tetsuo Toyama
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Harness, Dickey & Pierce, PLC
- Priority: JP2010-251091 20101109
- Main IPC: F28F13/18
- IPC: F28F13/18 ; F28D15/00 ; C09K5/10 ; F28F1/00 ; F28F21/00 ; F28F23/00
Abstract:
A heat transport fluid passage device for a heat transport circuit has a wall defining a passage through which a heat transport fluid flows. The heat transport fluid contains a solvent made of water or an organic substance and fine particles dispersed in the solvent. A hydrophobic membrane is formed on a surface of the wall.
Public/Granted literature
- US20120111549A1 HEAT TRANSPORT FLUID PASSAGE DEVICE WITH HYDROPHOBIC MEMBRANE Public/Granted day:2012-05-10
Information query
