Invention Grant
- Patent Title: Automatic soldering equipment
- Patent Title (中): 自动焊接设备
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Application No.: US13886268Application Date: 2013-05-02
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Publication No.: US09022275B2Publication Date: 2015-05-05
- Inventor: Chin-Changmr Hsieh
- Applicant: Inventec Corporation
- Applicant Address: TW Taipei
- Assignee: Inventec Corporation
- Current Assignee: Inventec Corporation
- Current Assignee Address: TW Taipei
- Agency: CKC & Partners Co., Ltd.
- Priority: TW102201767U 20130125
- Main IPC: B23K3/06
- IPC: B23K3/06

Abstract:
Automatic welding equipment includes a wave soldering machine including a tank, a plurality of first nozzles, a first pump, and a first guide plate. The tank has an opening. The first nozzles and melted solder are disposed in the tank. The first pump is disposed in the tank for jetting the solder via the first nozzles. The first guide plate is located at the opening and includes a first plate portion and a second plate portion. The first plate portion is located over the first nozzles and has a plurality of first holes for passed through by the solder jetted from the first nozzles. The second plate portion, connected to the first plate portion, guides the solder to flow out of the first holes. The solder guided by the second plate portion passes through second holes of the second plate portion and returns into the tank.
Public/Granted literature
- US20140209661A1 AUTOMATIC WELDING EQUIPMENT Public/Granted day:2014-07-31
Information query
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