Invention Grant
- Patent Title: Bearing assemblies including a thermally conductive structure, bearing apparatuses, and methods of use
- Patent Title (中): 轴承组件包括导热结构,轴承装置和使用方法
-
Application No.: US14309376Application Date: 2014-06-19
-
Publication No.: US09022657B2Publication Date: 2015-05-05
- Inventor: Jair Jahaziel Gonzalez , S. Barrett Peterson
- Applicant: US Synthetic Corporation
- Applicant Address: US UT Orem
- Assignee: US Synthetic Corporation
- Current Assignee: US Synthetic Corporation
- Current Assignee Address: US UT Orem
- Agency: Dorsey & Whitney LLP
- Main IPC: F16C17/00
- IPC: F16C17/00 ; F16C33/02 ; F16C43/02 ; F16C17/24 ; F16C33/04 ; F16C33/10 ; F16C33/26 ; B23K31/02 ; B23P15/00 ; F16C33/12 ; F16C37/00 ; F16C17/02 ; F16C17/04 ; F16C17/10

Abstract:
Embodiments of the invention are directed to bearing assemblies configured to effectively provide heat distribution from and/or heat dissipation for bearing element, bearing apparatuses including such bearing assemblies, and methods of operating such bearing assemblies and apparatuses. In an embodiment, a bearing assembly includes a plurality of superhard bearing elements distributed about an axis. Each superhard bearing element of the plurality of superhard bearing elements has a superhard material including a superhard surface. Additionally, a support ring structure that includes a support ring that supports the plurality of superhard bearing elements and a thermally-conductive structure in thermal communication with the superhard table of each of the plurality of superhard bearing elements. The thermally-conductive structure has a higher thermal conductivity than the support ring of the support ring structure.
Public/Granted literature
- US20140345141A1 BEARING ASSEMBLIES INCLUDING A THERMALLY CONDUCTIVE STRUCTURE, BEARING APPARATUSES, AND METHODS OF USE Public/Granted day:2014-11-27
Information query