Invention Grant
- Patent Title: Mold thickness adjusting apparatus of injection molding machine
- Patent Title (中): 注塑机模具厚度调节装置
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Application No.: US14075179Application Date: 2013-11-08
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Publication No.: US09022767B2Publication Date: 2015-05-05
- Inventor: Hajime Oono , Mitsushi Yoshioka
- Applicant: Fanuc Corporation
- Applicant Address: JP Yamanashi
- Assignee: Fanuc Corporation
- Current Assignee: Fanuc Corporation
- Current Assignee Address: JP Yamanashi
- Agency: Lowe Hauptman & Ham, LLP
- Priority: JP2012-247479 20121109
- Main IPC: B29C45/76
- IPC: B29C45/76 ; B29C45/17

Abstract:
An injection molding machine is provided with an automatic mold thickness adjusting apparatus. The amount of compensation of the position of a rear platen that is adjusted at the time of installation of a mold is determined by calculating the thermal expansion of the mold that is expected to occur at the completion of a rise in temperature based on the difference in temperature between the mold temperature at the time of mold thickness adjustment and the mold temperature at the time of injection molding. Then, the rear platen is moved to the compensated position thus determined.
Public/Granted literature
- US20140134284A1 MOLD THICKNESS ADJUSTING APPARATUS OF INJECTION MOLDING MACHINE Public/Granted day:2014-05-15
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