Invention Grant
- Patent Title: Connector and connector assembly
- Patent Title (中): 连接器和连接器组件
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Application No.: US13656044Application Date: 2012-10-19
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Publication No.: US09022803B2Publication Date: 2015-05-05
- Inventor: Keita Terajima
- Applicant: Tyco Electronics Japan G.K.
- Applicant Address: JP Kanagawa-ken
- Assignee: Tyco Electronics Japan G.K.
- Current Assignee: Tyco Electronics Japan G.K.
- Current Assignee Address: JP Kanagawa-ken
- Agent Barley Snyder
- Priority: JP2011-229680 20111019
- Main IPC: H01R13/40
- IPC: H01R13/40 ; H01R13/52 ; H01R13/62 ; H01R24/60

Abstract:
The connector includes a pin contact, a housing, a sealing member, and a limitation member. The pin contact is rod-shaped and makes contact with a mating contact. The housing includes a through hole through which the pin contact extends from a top of the housing to a bottom of the housing, with parts of the pin contact protruding from both of the top of the housing and the bottom of the housing. The sealing member seals the space between through hole and the pin contact. The limitation member applies a reaction force against a force experienced by the pin contact through a contact of the mating contact, so as to limit inclination of the pin contact.
Public/Granted literature
- US20130178098A1 Connector And Connector Assembly Public/Granted day:2013-07-11
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