Invention Grant
- Patent Title: Transdermal intraosseous device
- Patent Title (中): 经皮骨内装置
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Application No.: US13756040Application Date: 2013-01-31
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Publication No.: US09023115B2Publication Date: 2015-05-05
- Inventor: Joshua R. Porter , Troy W. Hershberger
- Applicant: Biomet Manufacturing LLC
- Applicant Address: US IN Warsaw
- Assignee: Biomet Manufacturing, LLC
- Current Assignee: Biomet Manufacturing, LLC
- Current Assignee Address: US IN Warsaw
- Agency: Harness, Dickey
- Main IPC: A61F2/78
- IPC: A61F2/78 ; A61F2/60 ; A61F2/28

Abstract:
A transdermal intraosseous device for coupling a bone stump to an external prosthetic device includes a bone fixator, an external connector and a plurality of modular interface components. The bone fixator includes a proximal portion configured for anchoring into the bone stump of the patient and a distal portion including a base collar configured for subcutaneous implantation. The external connector has a distal portion for coupling to the external prosthetic device and a proximal portion for coupling to the distal portion of the bone fixator. Each interface component can be removably coupled to the base collar and has different size and shape to provide a surgeon-selected transition between the prosthetic device and the patient's skin.
Public/Granted literature
- US20140214177A1 Transdermal Intraosseous Device Public/Granted day:2014-07-31
Information query
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