Invention Grant
- Patent Title: Thick film silver paste and its use in the manufacture of semiconductor devices
- Patent Title (中): 厚膜银浆及其在制造半导体器件中的应用
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Application No.: US13625930Application Date: 2012-09-25
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Publication No.: US09023254B2Publication Date: 2015-05-05
- Inventor: Kenneth Warren Hang , Yu-Cheng Lin , Yueli Wang
- Applicant: E I du Pont de Nemours and Company
- Applicant Address: US DE Wilmington
- Assignee: E I du Pont de Nemours and Company
- Current Assignee: E I du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: H01B1/02
- IPC: H01B1/02 ; H01B1/22 ; H01L31/0224
Abstract:
The present invention is directed to an electroconductive silver thick film paste composition comprising Ag, a glass frit and rhodium resinate, Cr2O3 or a mixture thereof all dispersed in an organic medium. The present invention is further directed to an electrode formed from the paste composition and a semiconductor device and, in particular, a solar cell comprising such an electrode. The paste is particularly useful for forming a tabbing electrode.
Public/Granted literature
- US20130099178A1 THICK FILM SILVER PASTE AND ITS USE IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES Public/Granted day:2013-04-25
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