A connecting film which electrically connects a first circuit member with a second circuit member having a nitrogen atom-containing film on a surface thereof facing the first circuit member, the connecting film including a first layer which is to be located at the first circuit member side, and a second layer which is to be located at the second circuit member side, wherein the first layer contains a cationic curing agent and an epoxy resin, and the second layer contains a radical curing agent, an acrylic resin and an epoxy compound, wherein one of the first layer and the second layer is a conductive particle-containing organic resin layer, and the other layer is an insulating organic resin layer containing no conductive particles, and wherein the minimum melt viscosity of the conductive particle-containing organic resin layer is ten times or more greater than that of the insulating organic resin layer.