Invention Grant
- Patent Title: Negative resist composition and patterning process
- Patent Title (中): 负阻抗组成和图案化工艺
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Application No.: US14138165Application Date: 2013-12-23
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Publication No.: US09023587B2Publication Date: 2015-05-05
- Inventor: Jun Hatakeyama , Koji Hasegawa , Daisuke Domon
- Applicant: Shin-Etsu Chemical Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2013-013960 20130129
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/32 ; G03F7/038 ; C08F220/18 ; C08F20/16 ; C08F18/04
Abstract:
A polymer comprising recurring units (a) of styrene having an HFA group and an ester group adjacent thereto and recurring units (b) having a hydroxyl group is used as base resin to formulate a negative resist composition. The negative resist composition has a high dissolution contrast in alkaline developer, high sensitivity, high resolution, good pattern profile after exposure, and a suppressed acid diffusion rate.
Public/Granted literature
- US20140212810A1 NEGATIVE RESIST COMPOSITION AND PATTERNING PROCESS Public/Granted day:2014-07-31
Information query
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