Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
-
Application No.: US13404652Application Date: 2012-02-24
-
Publication No.: US09023684B2Publication Date: 2015-05-05
- Inventor: Hideomi Suzawa , Shinya Sasagawa
- Applicant: Hideomi Suzawa , Shinya Sasagawa
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2011-048134 20110304
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/49 ; H01L29/786 ; H01L29/66

Abstract:
An object is to provide a transistor including an oxide semiconductor having favorable electrical characteristics and a manufacturing method thereof. A semiconductor device includes an oxide semiconductor film and an insulating film over a substrate. An end portion of the oxide semiconductor film is in contact with the insulating film. The oxide semiconductor film includes a channel formation region and regions containing a dopant between which the channel formation region is sandwiched. The semiconductor device further includes a gate insulating film over and in contact with the oxide semiconductor film, a gate electrode with a sidewall insulating film over the gate insulating film, and a source electrode and a drain electrode in contact with the sidewall insulating film, the oxide semiconductor film, and the insulating film.
Public/Granted literature
- US20120225520A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2012-09-06
Information query
IPC分类: