Invention Grant
- Patent Title: Method of manufacturing metal silicide layer
- Patent Title (中): 金属硅化物层的制造方法
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Application No.: US14019813Application Date: 2013-09-06
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Publication No.: US09023728B2Publication Date: 2015-05-05
- Inventor: Makoto Honda
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Priority: JP2013-062428 20130325
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/285

Abstract:
According to one embodiment, a method of manufacturing a metal silicide layer, the method includes forming a metal layer including impurities on a silicon layer by a vapor deposition method using a gas of a metal and a gas of the impurities, and forming a metal silicide layer including the impurities by chemically reacting the metal layer with the silicon layer. A thickness and a composition of the metal silicide layer are controlled by an amount of the impurities in the metal layer.
Public/Granted literature
- US20140287582A1 METHOD OF MANUFACTURING METAL SILICIDE LAYER Public/Granted day:2014-09-25
Information query
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