Invention Grant
- Patent Title: Thermosensitive recording material
- Patent Title (中): 热敏记录材料
-
Application No.: US14005444Application Date: 2012-07-27
-
Publication No.: US09023756B2Publication Date: 2015-05-05
- Inventor: Kenji Shimizu , Hideo Aihara , Daiki Iwata
- Applicant: Kenji Shimizu , Hideo Aihara , Daiki Iwata
- Applicant Address: JP Tokyo
- Assignee: Ricoh Company, Ltd.
- Current Assignee: Ricoh Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Cooper & Dunham LLP
- International Application: PCT/JP2012/069779 WO 20120727
- International Announcement: WO2013/018875 WO 20130207
- Main IPC: B41M5/30
- IPC: B41M5/30 ; B41M5/41 ; B41M5/44
Abstract:
To provide a thermosensitive recording material, which contains: a support; a thermosensitive recording layer provided on one surface of the support; and a back layer provided on the other surface of the support, wherein the support has a surface formed of a resin, and wherein the back layer contains a combination of a core-shell acrylic resin and an oxazoline resin, or a reaction product thereof, or both thereof.
Public/Granted literature
- US20140148334A1 THERMOSENSITIVE RECORDING MATERIAL Public/Granted day:2014-05-29
Information query
