Invention Grant
- Patent Title: Polypropylene resin foam particle and molding thereof
- Patent Title (中): 聚丙烯树脂泡沫颗粒及其成型
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Application No.: US12451919Application Date: 2008-05-14
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Publication No.: US09023904B2Publication Date: 2015-05-05
- Inventor: Hidehiro Sasaki , Masaharu Oikawa , Tokunobu Nohara
- Applicant: Hidehiro Sasaki , Masaharu Oikawa , Tokunobu Nohara
- Applicant Address: JP Tokyo
- Assignee: JSP Corporation
- Current Assignee: JSP Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2007-164724 20070622
- International Application: PCT/JP2008/058830 WO 20080514
- International Announcement: WO2009/001626 WO 20081231
- Main IPC: C08F10/06
- IPC: C08F10/06 ; C08J9/00 ; C08J9/12 ; C08J9/18 ; C08J9/232 ; C08F110/06 ; C08F210/06

Abstract:
A polypropylene resin foamed bead from which a foamed bead molded article excelling in appearance, heat resistance and mechanical properties can be obtained at the molding temperature lower than that for conventional polypropylene resin foamed beads; and a foamed bead molded article obtained by molding the same. The polypropylene resin foamed bead is characterized by having such a crystal structure that in the first DSC curve obtained when the temperature of the foamed bead sample is raised from ordinary temperature to 200° C. at a temperature rising rate of 2° C./min by a differential scanning calorimetry, there appear a main endothermic peak of 100° to 140° C. endothermic peak apex temperature exhibiting 70 to 95% endothermic peak calorific value based on the total endothermic peak calorific value and two or more endothermic peaks exhibited on the high temperature side with respect to the main endothermic peak.
Public/Granted literature
- US20100105787A1 POLYPROPYLENE RESIN FOAM PARTICLE AND MOLDING THEREOF Public/Granted day:2010-04-29
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