Invention Grant
- Patent Title: Adhesive composition
- Patent Title (中): 粘合剂组合物
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Application No.: US14041611Application Date: 2013-09-30
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Publication No.: US09023927B2Publication Date: 2015-05-05
- Inventor: Mikio Shiono , Kenichi Fukuda
- Applicant: Shin-Etsu Chemical Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2012-225707 20121011
- Main IPC: C08K5/541
- IPC: C08K5/541 ; C09J11/06 ; C09J183/06 ; C09J183/08 ; C09J183/12 ; C08G77/12 ; C08G77/14 ; C08G77/18 ; C08K9/06

Abstract:
An adhesive composition is provided comprising (A) a linear polyfluoro compound having at least two alkenyl groups and a perfluoropolyether structure in its main chain, (B) a fluorinated organohydrogensiloxane having at least two SiH groups, (C) a hydrosilylation catalyst, (D) hydrophobic silica powder, (E) a fluorinated acetylene alcohol, and (F) an organosiloxane containing a SiH group and an epoxy and/or trialkoxysilyl group. A cured product of the composition has a smooth and uniform surface.
Public/Granted literature
- US20140107263A1 ADHESIVE COMPOSITION Public/Granted day:2014-04-17
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