Invention Grant
- Patent Title: Urethane resin particles
- Patent Title (中): 聚氨酯树脂颗粒
-
Application No.: US13884771Application Date: 2011-11-09
-
Publication No.: US09023941B2Publication Date: 2015-05-05
- Inventor: Shinji Watanabe , Yasuhiro Tsudo , Masaki Inaba , Jun Takeuchi , Yuko Matsumoto
- Applicant: Shinji Watanabe , Yasuhiro Tsudo , Masaki Inaba , Jun Takeuchi , Yuko Matsumoto
- Applicant Address: JP Kyoto-shi
- Assignee: Sanyo Chemical Industries, Ltd.
- Current Assignee: Sanyo Chemical Industries, Ltd.
- Current Assignee Address: JP Kyoto-shi
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2010-253674 20101112; JP2011-088028 20110412; JP2011-107339 20110512
- International Application: PCT/JP2011/006263 WO 20111109
- International Announcement: WO2012/063483 WO 20120518
- Main IPC: C08G18/83
- IPC: C08G18/83 ; C08G18/42 ; C08K5/092 ; C08K5/103 ; C08G18/80 ; C08G18/32 ; C08L75/06 ; B29C41/00 ; B29C41/18 ; C08G18/66 ; C08G18/73 ; C08G18/12 ; C08G18/28 ; C08G18/34 ; C08K5/04 ; C08L75/12 ; B29K75/00

Abstract:
Provided is a slush molding material which exhibits excellent low-temperature meltability and heat resistance and which can yield a molded product having excellent tensile strength and elongation. The present invention is urethane resin particles (D1) comprising a urethane or urethane-urea resin (U1) that has residues (j) bonded thereto covalently, said residues (j) being residues derived from an at least trivalent aromatic polycarboxylic acid by removing hydroxyl groups, or urethane resin particles (D2) comprising a urethane resin composition (S2) which comprises both a urethane or urethane-urea resin (U2) and a compound (E) that has a residue (j) derived from an at least trivalent aromatic polycarboxylic acid by removing hydroxyl groups, said compound (E) being represented by general formula (1), wherein the residues (j) are linked respectively to urethane or urea groups (u) of the resin (U1) or (U2) by hydrogen bonds.
Public/Granted literature
- US20130237664A1 URETHANE RESIN PARTICLES Public/Granted day:2013-09-12
Information query